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Wafer Surface Charge Reversal as a Method of Simplifying Nanosphere Lithography for Reactive Ion Etch Texturing of Solar Cells
Simplifying Nanosphere Lithography Solar Cells
2008/10/30
A simplified nanosphere lithography process has been developed which allows fast and low-waste maskings of Si surfaces for subsequent reactive ion etching (RIE) texturing. Initially, a positive surfac...
nm- and μm-Scale Surface Roughness on Glass with Specific Optical Scattering Characteristics on Demand
Specific Optical Demand
2008/10/29
During maskless ion etching of amorphous glass, self-organization can arise in certain etch parameter ranges, which leads to dense-lying dots/cones with typical diameters and heights in the 30–300R...